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Coil Board Product List

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Thick copper busbar substrate and coil substrate [Proven up to a copper thickness of 3.0mm]

By substrate-izing busbars and coils used for high current applications, high insulation properties and a reduction in labor hours are achieved!

We have substrate-mounted busbars and coils used for high current applications in the heavy electrical and automotive industries. By substrate mounting, the following effects can be expected: - Substrate mounting of power devices such as IGBTs and SiCs - Installation on equipment after substrate mounting → Reduction of assembly work and prevention of miswiring - Space-saving due to substrate mounting and simplification of wiring → Miniaturization of the entire device - Generally, a thick copper substrate refers to a substrate with a copper foil thickness of 200μ (0.2mm) or more, but we have also achieved substrate mounting with 3000μ (3mm) copper plates. - The greatest advantage of substrate mounting is its high insulation performance and usability. The insulation layer using prepreg has a consistent thickness, so there is no concern about variation in thickness like with powder coating. - By covering areas other than the necessary parts with the substrate, handling becomes easier, and work during transportation and installation can be performed safely. *For more details, please refer to the PDF document or feel free to contact us.

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  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Coil Board

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Thick copper busbar substrate and coil substrate for electric vehicles

Contributing to the miniaturization of devices! Proven performance exceeding 100A, achieving high insulation and reduced labor for high current applications.

In the high-power supply of the electric vehicle industry, components that can safely and efficiently transmit large currents are required. In particular, reliable connections to power devices and placement within limited space significantly impact the overall performance and design flexibility of the vehicle. Improper wiring or insufficient insulation can lead to performance degradation and safety issues. Our thick copper busbar substrates and coil substrates address these challenges by substrate-mounting busbars and coils used in high-current applications. 【Usage Scenarios】 - Inverters, converters, and charging systems for electric vehicles - High-power battery systems - Power control units 【Benefits of Implementation】 - Substrate mounting of power devices such as IGBTs and SiCs - Reduction of assembly labor and prevention of miswiring - Miniaturization of the entire device

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  • img09.jpg
  • img11.jpg
  • IPROS10697054468954836760.jpeg
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Coil Board

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Thick copper busbar substrates and coil substrates for ships.

Contributing to the control of ship propulsion! Improving reliability and efficiency through substrate technology for high current applications.

In ship propulsion control systems, the reliability and efficiency of components handling high currents are essential. In particular, complex wiring and high-voltage control can lead to issues such as miswiring troubles and space constraints. To address these challenges, by integrating busbars and coils into a substrate, we can achieve high insulation and simplify wiring, contributing to the construction of a safe and efficient propulsion control system. 【Application Scenarios】 - Consolidation of high-current circuits in propulsion control systems - Implementation of power devices (IGBT, SiC, etc.) - Effective utilization of onboard space 【Benefits of Implementation】 - Reduction in assembly labor and risk of miswiring - Space-saving and miniaturization of the entire device - Improved reliability due to high insulation performance

  • img02.jpg
  • img09.jpg
  • img11.jpg
  • IPROS10697054468954836760.jpeg
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Coil Board

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Thick copper busbar substrate and coil substrate for data centers

Contributing to the improvement of cooling efficiency in data centers! Achieving space-saving through substrate design for high current applications.

In data centers, the stable operation of equipment and the maintenance of cooling efficiency are prioritized. Particularly in areas where large currents flow, heat suppression and safety assurance are required. Conventional busbars and coils face challenges in securing wiring space and insulation processing, which can impact the overall cooling efficiency of the equipment. Our thick copper busbar substrates and coil substrates address these issues by simplifying wiring through substrate integration and providing high insulation performance, contributing to space-saving and improved cooling efficiency in data centers. 【Usage Scenarios】 - High current wiring within server racks - High current transmission in cooling systems - Wiring around power supply units 【Benefits of Implementation】 - Reduction of installation space due to overall equipment miniaturization - Increased efficiency in assembly work through reduced wiring labor and prevention of miswiring - Enhanced safety due to high insulation performance - Assurance of reliability through a consistent insulation layer thickness

  • img02.jpg
  • img09.jpg
  • img11.jpg
  • IPROS10697054468954836760.jpeg
  • Printed Circuit Board
  • Circuit board design and manufacturing
  • Coil Board

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